With ultra-thin glass under 0.1mm deep processing process and technology
TFT-LCD glass, ultra - thin glass processing capacity
Processing thickness: 0.05mm (single side thinning), plate thickness deviation within ±10%
With mature OLED panel thin processing process and process
Maximum machining size: G6 half (1500*925mm) (single side thinning)
It is capable of processing OLED single board, OLED composite board and PF screen printing
Maximum machining size:G6(1500*1850mm)
Processing thickness: 0.1mm (single side), thickness uniformity deviation within ±10%
Advanced grinding and polishing equipment
With mature coating processing of s-ito, IMITO, MB, high resistance film, etc